I—Overview.- 1 Introduction.- 1.1 Purpose of the Book.- 1.2 Electronics Industry in General.- 1.3 Electronics Packaging and Market.- 1.4 Surface Mount Technology.- 1.5 Surface Mount Technology Market.- 1.6 Surface Mount Components.- 1.7 Surface Mount Land Patterns.- 1.8 Surface Mount Processes.- 1.9 Surface Mount Device Reliability.- 1.10 Utility of the Book.- 2 Interdisciplinary Approach.- 2.1 Basic Function.- 2.2 Materials.- 2.3 Compositional Constitution.- 2.4 Technology.- 2.5 Interplay of Technology.- II—Basic Technologies.- 3 Chemical and Physical Characteristics.- 3.1 Performance Parameters.- 3.2 Physical Properties.- 3.3 Fluxes and Fluxing.- 3.4 Flux Chemistry.- 3.5 Rosin Chemistry.- 3.6 Tackiness and Adhesion.- 3.7 Thermal Properties.- 3.8 Dryability.- 3.9 Residue.- 3.10 Solderability.- 3.11 Solderability: Components.- 3.12 Metal Load Acceptability.- 3.13 Flow Properties.- 3.14 Exposure Life.- 3.15 Formulation.- 4 Metallurgical Aspects.- 4.1 Alloys in General.- 4.2 Solder Alloy.- 4.3 Phase Diagrams.- 4.4 Phase Diagrams: Solder Alloys.- 4.5 Wetting and Spreading.- 4.6 Solidification.- 4.7 Heat Treatment and Thermal Excursion.- 4.8 Metal Powder.- 4.9 Solder Powder Characteristics.- 4.10 Physical Properties of Solder Alloys.- 4.11 Mechanical Properties of Solder Alloys.- 5 Rheology of Solder Pastes.- 5.1 Requirements and Driving Forces.- 5.2 Flow Behavior: TheoreticalBackground.- 5.3Elastic Behavior: TheoreticalBackground.- 5.4 Mechanical Models.- 5.5 Flow Characteristics.- 5.6 Elastic Characteristics.- 5.7 Characterization Versus Performance.- 5.8 Single Point Viscosity Measurement.- 5.9 Viscosity Versus Temperature andOther Factors.- III—Methodologies and Applications.- 6 Application Techniques.- 6.1 Introduction.- 6.2 Printer.- 6.3 Printing Mode.- 6.4 Screen Hardware.- 6.5 Screen Artwork and Patterns.- 6.6 Screen Cleaning and Maintenance.- 6.7 Squeegee System.- 6.8 Snap-off.- 6.9 Printing Principles.- 6.10 Printing Variables.- 6.11 Printing Operation.- 6.12 Considerations for Printing ParameterSelection.- 6.13 Differential Thickness Printing.- 6.14 Printing Environment and PasteHandling.- 6.15 Pneumatic Dispensing.- 6.16 Positive Displacement Dispensing.- 6.17 Dispensing Operation.- 6.18 Pin Transfer.- 7 Soldering Methodologies.- 7.1 Introduction.- 7.2 Thermal Conduction.- 7.3 Thermal Radiation.- 7.4 Thermal Convection.- 7.5 Reflow Methods.- 7.6 Conduction Reflow.- 7.7 Infrared Reflow: Furnace Type.- 7.8 Infrared Reflow Dynamics.- 7.9 Infrared Reflow Profile.- 7.10 Infrared Reflow Operation.- 7.11 Temperature Monitoring.- 7.12 Vapor Phase Reflow.- 7.13 Convection Reflow.- 7.14 Hot Gas Reflow.- 7.15 Resistance Reflow.- 7.16 Laser Reflow.- 7.17 Intelligent Laser Soldering.- 7.18 Induction Reflow.- 7.19 Temperature Profiling Versus PastePerformance.- 7.20Temperature Profiling VersusComponent.- 7.21Temperature Profiling Versus SolderingProblems.- 7.22Comparison of Reflow Methods.- 8 Cleaning.- 8.1 Solder Paste Residue.- 8.2 What Is Cleaning?.- 8.3 Cleaning Principle.- 8.4 Factors of Cleaning Efficiency.- 8.5 Solvent.- 8.6 Solubility Parameters.- 8.7 Solvent Cleaning Technique andEquipment.- 8.8 Ultrasonic Cleaning.- 8.9 Aqueous Cleaning.- 8.10 White Residue.- 8.11 Solder Ball Removal.- 8.12 Cleanliness Measurement.- 8.13 Safety and Health.- 8.14 Ozone Depletion.- IV—Reliability, Quality Control, and Tests.- 9 Solder Joint Reliability and Inspection.- 9.1 Introduction.- 9.2 Factors of Solder Joint Integrity.- 9.3 Creep.- 9.4 Fatigue.- 9.5 Thermal Fatigue.- 9.6 Intrinsic Thermal Expansion Anisotropy.- 9.7 Corrosion-Enhanced Fatigue.- 9.8 Coating Considerations.- 9.9 Intermetallic Compounds.- 9.10 Solder Joint Voids.- 9.11 State-of-the-Art Studies.- 9.12 Solder Joint Appearance.- 9.13 Solder Joint Inspection.- 10 Special Topics in Surface Mount Soldering Problems and Other Soldering-RelatedProblems.- 10.1 Surface Mount J-Lead Wicking.- 10.2 Inserted Lead Wicking.- 10.3 Clip-on Lead Wicking.- 10.4 Tombstoning.- 10.5 Solder Balling.- 10.6 Residue Cleaning.- 10.7 Pad Bridging.- 10.8 Paste Tack Time.- 10.9 Paste Open Time.- 10.10 Lot-to-Lot Consistency.- 10.11 Electromigration.- 10.12 Leaching.- 10.13 Solderability.- 10.14 Solder Joint Integrity.- 11 Quality Assurance and Tests.- 11.1 Quality.- 11.2 Appearance.- 11.3 Metal Content.- 11.4 Density.- 11.5 Viscosity.- 11.6 Viscosity Versus Shear Rate.- 11.7 Cold Slump.- 11.8 Hot Slump.- 11.9 Molten Flow.- 11.10 Tack Time.- 11.11 Dryability.- 11.12 Dispensability.- 11.13 Printability.- 11.14 Shelf Stability.- 11.15 Handling and Safety.- 11.16 Water Extract Resistivity.- 11.17 Copper Mirror.- 11.18 Chloride and Bromide.- 11.19 Acid Number.- 11.20 Infrared Spectrum Fingerprint andOther Spectroscopies.- 11.21 Alloy Composition.- 11.22 Particle Size—Sieve.- 11.23 Particle Size Distribution—SediGraph.- 11.24 Particle Shape.- 11.25 Particle Surface Condition.- 11.26 Dross.- 11.27 Melting Range.- 11.28 Solder Ball.- 11.29 Solderability.- 11.30 Exposure Time.- 11.31 Soldering Dynamics.- 11.32 Cleanliness.- 11.33 Surface Insulation Resistance.- 11.34 Other Post-Reflow Examinations andTests.- 11.35Required Tests.- V—Future Tasks and Emerging Trends.- 12 Future Developments.- 12.1 Quality-Driven.- 12.2 Mirror and Marriage.- 12.3 Conductive Adhesive.- 12.4 Tasks and Issues.- 12.5 Conclusion.- VI—Appendix.- I. Federal Specification QQ-S-571E and Amendment 4.- II. Ternary Phase Diagram: Pb-Ag-Sn, Sn-Pb-Bi.- III. Military Specification MIL-P-28809A: PrintedWiring Assemblies.- IV.Quantitative Determination of Rosin Residues onCleaned Electronics Assemblies.
